VOICE 2008 Speakers

At this year's VOICE we will be hosting a panel discussion on the topic: Achieving the TTx (x ε {Market, Volume, Yield}): Meeting exponentially rising expectations.

In the consumer era, the product life cycles get shorter and shorter. Meeting the ever pressing time lines is extremely important for the success of a product and to maximize the return on investments. Each of the three time metrics time to market, volume and yield need to be precisely met. While expectation on each it are rising exponentially, the challenges to meet them are rising in the same proportion. The challenges in the design verification and 1st silicon debug are making it very difficult to meet time-to-market windows. Similarly, ramping the volume is becoming difficult due to dominance of design-process interaction related issues which require analysis of volume of parts and a longer loop through design to fix the issues. The challenges to achieve the entitlement yield in the short product life time are adding to the complexity.

In addition to the technical challenges mentioned above, there are also economic and organizational challenges that a company has to tackle. For example, balancing the investment across three objectives is difficult and yet very crucial.

This panel will discuss the challenges related to meeting these exponentially rising expectation on time lines and assess the state of tools and methodologies to identify the gaps and solutions.

Moderator: G. Dan Hutcheson, CEO, VLSI Research

G. Dan Hutcheson

VLSI Research

Dan is CEO of VLSI Research Inc. He is a recognized authority and well-known visionary for the semiconductor industry whose career experience spans more than thirty years. Much of his career has been spent advising companies in strategic and tactical marketing; business management; and manufacturing trends, productivity, and strategy. During his career, Dan has authored numerous publications, developed many industry models, and researched most aspects of the semiconductor industry. Dan is probably best known for being the first to forecast an industry recession and for having developed the industry's first cost-of-ownership model in the early eighties. He also built the first factory cost-optimization model in 1984. Similar models are now the mainstay of capital decision-making.

Dan is also a founder and director of weSRCH.com — the leading Science 2.0 website covering the Electronics, Medical and Solar disciplines. weSRCH.com is the social networking site where leading technologists go to interact with their peers. Dan created weSRCH.com because he saw research costs escalating faster than industry revenues were growing. He knew consortia had stemmed the growth of research costs by providing for better industry-wide communication. weSRCH.com is an attempt to do the same thing, using the latest Internet 2.0 technology that has made social networking sites like YouTube and MySpace so dynamic. Dan holds a master's degree in Economics from San Jose State and has completed additional engineering coursework from UC Berkeley.
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Octavio Martinez

Director of Test Engineering, QUALCOMM CDMA Technologies Division

Octavio Martinez is in charge of product and test development for QUALCOMM'S Single Chip solution product family, which integrates Digital, Analog, Power Management and RF into a single package. As Mixed Signal Test Engineering department manager, Mr. Martinez has been involved with ATE testing for over 16 years. He has experience in testing digital, analog, mixed signal and RF circuits. In his latest role, he is in charge of test development for SiP (System in Package) and SOC (System On Chip) devices that will keep QUALCOMM in the forefront of technology. Professional interests include ATE (Automated Test Equipment) IC testing, COT (Cost of Test), DFT (Design for Test) and DFM (Design for Manufacturability). Prior to joining QUALCOMM, Mr. Martinez worked for Brooktree Corporation as a mixed signal test engineer. He holds a B.S.E.E. and an M.B.A from San Diego State University.
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Scott Gatzemeier

IMFT Product Integration Engineering Manager, IMFT

Scott started his career at Micron as a Probe DRAM Engineer after graduating from the University of North Dakota in 1997 with an Electrical Engineering degree. Scott was promoted to Probe Flash Engineering Supervisor in 2001, with responsibility for Micron's NOR Flash product lines, as well as hiring and training several engineers on probe test equipment and device operation. Since the beginning of the NAND Flash product line in 2004, Scott was the Flash Engineering Manager in the Probe area with responsibility for both NOR and NAND product lines. While working for Micron, Scott also found time to complete his MBA from NTU.

In 2006, Scott was selected as the Fab 2 Probe Section Manager, where he successfully led the Probe Team during the startup and fab ramp. During that time the probe team has installed, qualified, and released over 100 Probe tools, and implemented many cost saving projects including significant test time reduction, increased tool utilization and full wafer contact probing. In March of this year Scott was promoted to the IMFT Product Integration Engineering Manager and now has responsibility for Probe, QA, Yield Enhancement and Process Integration.
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Sanjiv Taneja

Vice President of the Encounter Test Business, Cadence

Sanjiv Taneja is Vice President of the Encounter Test business unit at Cadence Design Systems. Prior to assuming this role in 2005, Sanjiv served in a variety of senior management roles in engineering, product marketing and business development since joining Cadence in 1998.

Sanjiv started his career at Bell Labs in Murray Hill, NJ where he spent over 13 years in EDA software development and management, led the Custom/Analog Layout Automation group, and launched and rapidly grew the EDA technology licensing business. Sanjiv holds a BS degree in Electrical Engineering from Indian Institute of Technology, New Delhi, a MS degree in Computer Science from Ohio State University, and an MBA from New York University.
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Raymond Lee

VP of Engineering, NANO ISI

Raymond has vast experience with semiconductor design, debug and failure analysis. He brings distinctive and valuable insights to Nano Integrated Solutions' comprehensive product engineering solutions.

Before helping start Nano Integrated Solutions in 2007, Raymond was founder and President of FIB International, Inc. an analytical lab for the testing, debug and failure analysis of microelectronic devices. Founded in 1996, it quickly became the leader of FIB technologies thanks to its highly experienced staff and state-of-the-art equipments. Raymond worked with numerous startup and established design houses on the latest generation of products while developing new protocols and methodologies to meet the challenges of the industry.

Earlier, Raymond worked for various semiconductor equipment companies like FEI and Schlumberger ATE doing marketing and application development. By working closely with equipment suppliers and customers, he was able to help develop new solutions for the increasingly complex semiconductor sector.

Raymond holds a MBA from Santa Clara University and a BS from the University of California, Berkeley.
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Memory Track Keynote Address: Major Forces Shaping the Global Semiconductor Industry

Bill McClean of IC Insights

Prior to forming IC Insights, Mr. McClean worked at ICE Corporation for 17 years—the last ten as Vice President of Market Research. With more than 25 years of experience tracking the IC industry, Mr. McClean has become a well-known authority on market and technology analysis and forecasting. He specializes in tracking global economic conditions, developing IC market forecasts, analyzing capital spending and fab capacity trends, researching ASIC markets and technologies, and following emerging markets for ICs such as cellular phones. He serves as Contributor and Managing Editor of IC Insights' studies and other products, and has been a guest speaker at many important annual conferences held worldwide, including SEMI's Industry Strategy Symposium, Rose Associates' Electronic Materials Conference, and Future Horizons' Electronics Industry Forum. Mr. McClean has a Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.
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